STRUCTURE–PROPERTY RELATIONSHIP OF ORGANOSILICON MATERIALS: EVALUATION BASED ON THERMOGRAVIMETRIC ANALYSIS

Tosheva , Dilfuza, Siddikov, Ikrom, Rakhimov , Firuz

Innovation science and technologiy · 2025-yil

Annotatsiya

This article presents a comprehensive scientific evaluation of the structure–property relationships oforganosilicon materials using thermogravimetric analysis (TGA). Due to the high bond energy of the –Si–O– linkage,polyorganosiloxanes and their derivatives exhibit remarkable thermal stability at elevated temperatures. By applying TGAand DTG methods, the decomposition stages, onset and peak temperatures, residual mass, and decomposition rate ofthe materials were accurately determined. Kinetic analyses based on the Kissinger and Flynn–Wall–Ozawa methods wereconducted to calculate the activation energy and assess the influence of structural parameters on thermal performance.The results confirm that the thermal resistance of organosilicon materials directly depends on the chemical nature of sidegroups, the degree of molecular branching, and the incorporation of nanofillers.

Maqola ma’lumotlari
MualliflarTosheva , Dilfuza, Siddikov, Ikrom, Rakhimov , Firuz
JurnalInnovation science and technologiy
Nashr sanasi2025-11-01
Jild1
Son11
TilIngliz
DOI10.5281/zenodo.17535044

Kalit so‘zlar

organosilicon materials, thermogravimetric analysis, structure–property relationship, thermal stability, activation energy, nanofillers

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